Competencies include high speed circuit board contenting, electronics assembly, environmental encapsulation, optical inspection, computerized end of line functional testing, wire harness and electro-mechanical assembly. We are compliant with all industry standards for quality and environmental management including TS-16949, ISO 9001 and ISO 14001certification. PI embraces Lean manufacturing principles to ensure efficient processes and the reduction of waste. Our manufacturing systems support build-to-order production demand, high volume requirements, and system integration needs.
Key manufacturing attributes include:

•  Lead Pb free processing
•  High speed SMT component placement and reflow soldering
•  Automated Through Hole component contenting
•  Wave soldering
•  High volume microcontroller programming systems
•  Potting encapsulation equipment
•  Conformal coating capabilities
•  Automated vision inspection
•  Automated multi-task wire processing equipment
•  Ultrasonic wire splicing
•  Wire Braiding 
•  Automated conduit preparation
•  Automated harness taping
•  In circuit automated inspection and testing
•  Computerized final functional EOL